OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1M3FT 800G Twin-port OSFP 8 x 100G PAM4 IHS/Finned Top to 4 x 200G QSFP112 2 x 100G PAM4 Passive Copper Breakout Cable, 1m (3ft)

Product Highlights

• HT-manufactured DAC assembly in 1m (3ft)
• 800G connectivity at 800Gbps
• Interface configuration: OSFP (IHS/Finned Top) to 4x QSFP112
• Fixed length and part number: 1m (3ft), OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1M3FT
• Cable construction: Passive Breakout DAC
• Conductor specification: 28AWG
• Maximum power consumption: 0.1W (OSFP End)0.1W (QSFP112 Per End)
• Minimum bend radius: 31mm

Specifications

Signal and Lane Configuration

The listed modulation format is OSFP-8x 100G-PAM4QSFP112-2x 100G-PAM4. Both host interfaces must be configured for the same aggregate rate and lane arrangement. A connector that fits mechanically does not by itself guarantee that the remote port supports this encoding or breakout mode.

Passive Copper Operation

A passive DAC has no separate optical conversion stage. Its low-power, low-latency operation is useful for short equipment links, but the assembly must remain within the length and signaling mode accepted by both hosts.

Length Selection and Installation Planning

At 1m (3ft), OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1M3FT is a practical choice for direct connections within one rack. Route the cable along the intended management path rather than pulling it diagonally across adjacent connectors, and leave enough clearance for insertion, removal and front-panel airflow.

Position Within the Length Range

OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1M3FT occupies the middle of this family between OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-0.5M2FT at 0.5m (2ft) and OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1.5M5FT at 1.5m (5ft). It adds 0.5m over the shorter option for extra routing clearance, while the next longer version adds another 0.5m. Measure the managed path and choose this version when its reach is sufficient without creating the slack associated with the longer assembly.

Data-Center Design and Airflow

Select the assembly by both reach and rack layout. A direct connection removes separate module-and-patch-cord interfaces, but it still needs a bend-safe pathway and clear connector access. Keep cable bundles from blocking front-panel airflow, account for the listed interface power where applicable and choose a length that supports maintenance without leaving an unmanaged coil. For this assembly, the listed conductor specification is 28AWG; the minimum bend radius is 31mm; the stated power consumption is 0.1W (OSFP End)0.1W (QSFP112 Per End); the jacket material is PVC.

Power and Thermal Planning

The rated power consumption is 0.1W (OSFP End)0.1W (QSFP112 Per End). Include this load in the host-port power and thermal budget, especially in densely populated switches. Maintain front-panel clearance and do not bundle the cable so tightly that it obstructs airflow around the connectors.

Cable Construction and Routing

This assembly uses 28AWG conductors, PVC jacket, minimum bend radius 31mm. These mechanical characteristics affect how the cable should be dressed behind the equipment. Avoid sharp edges, excessive ties and repeated tight bends close to the connector boots.

Network and Protocol Considerations

The intended application is 800G/200G Ethernet. Listed interface and protocol references include OSFP MSA, QSFP112 MSA, IEEE 802.3ck, CMIS v5.0. Confirm that the host firmware and port configuration support the same operating mode.

Breakout Port Mapping

The OSFP (IHS/Finned Top) to 4x QSFP112 configuration divides the high-speed interface into multiple lower-speed connections. Verify the upstream lane assignment, downstream port speeds and breakout setting on the host before connecting the assembly. Each branch must attach to the correct remote interface.

Quality Assurance and Packaging

Each cable receives connector inspection and a functional link check before it is coiled with bend-safe slack and packed. Protective materials shield the connector housings during transport. Rack or project labels are available to keep length, part number and installation destination aligned. Volume orders can include customer references on the labels and carton list.

Ordering Information

Provide the OEM reference, HT part number, fixed length and quantity, together with the intended host interfaces. Rack-based quantities and packaging instructions can be included for larger deployments. Other lengths are separate products and should be entered on their own order lines. Keep OSFP (IHS/Finned Top) to 4x QSFP112-800G-DAC-1M3FT associated with 1m (3ft) throughout the order and receiving record.

Generic Compatibility and Factory Testing

Compatibility confirmation combines host identification with actual link establishment and diagnostic checks. The assembly is prepared for the stated OEM reference rather than selected only by connector shape. For a new data-center deployment, the equipment model, port mode and software release provide the most useful basis for a pre-order review. The check includes link stability and diagnostic indications, followed by a final inspection of both ends.

Frequently Asked Questions

Shipping and Lead Time

Available stock is generally dispatched within one to three working days after order confirmation, with production lead times advised for larger quantities. Delivery can be arranged by courier, air freight or sea freight, and goods may instead be handed to an appointed forwarder or shipped on the customer’s courier account.